Thermoplastic resin composition and sheets and cards made from the same

ABSTRACT

Cards which contain any one of the following thermoplastic resin compositions I to III in its material can be used as magnetic cards, IC cards, etc. since they are excellent in heat resistance, processability and embossability:  
     I. A composition consisting of the following ingredients (A) and (B)  
     II. A composition consisting of the following ingredients (A), (B) and (D)  
     III. A composition consisting of 100 parts by weight of one or more selected from the following ingredients (A), (B) and (D) and 2 to 25 parts by weight of the following ingredient (C)  
     (In the above I to III,  
     the Ingredient A is a polyester composed of dicarboxylic acid components with terephthalic acid component as a main dicarboxylic acid component and ethylene glycol component (I) and 1,4-cyclohexanedimethanol component (II) as main glycol components, with the molar ratio (I)/(II) of ethylene glycol component (I) to 1,4-cyclohexanedimethanol component (II) kept at 1 or more;  
     ingredient B is an aromatic polycarbonate;  
     ingredient C is an inorganic sheet-like filler of 0.5 to 20 μm in average grain size; and  
     the ingredient (D) is a polyester composed of dicarboxylic acid components with terephthalic acid component as a main dicarboxylic acid component and ethylene glycol component (I) and 1,4-cyclohexanedimethanol component (II) as main glycol components, with the molar ratio (I)/(II) of ethylene glycol component (I) to 1,4-cyclohexanedimethanol component (II) kept at smaller than 1.)

BACKGROUND ART

[0001] The present invention relates to cards such as magnetic cards andIC cards excellent in the balance among heat resistance, processabilityand embossability, a sheet suitable for such cards, and a thermoplasticresin composition for such cards and sheet.

[0002] In recent years, cards such as magnetic cards and IC cards areused for various applications. These cards are often embossed tothree-dimensionally highlight symbols and characters. These cards aregenerally formed by a multi-layer sheet made of hard polyvinyl chlorideresin. However, since polyvinyl chloride resin is poor in durability andheat resistance, it may be deformed when exposed to a high temperature,and an embossable card material excellent in heat resistance tosubstitute polyvinyl chloride resin has been being demanded.

[0003] Since 1,4-cyclohexanedimethanol derivative copolymerizedpolyesters are well embossable resins and are also excellent inmechanical strength and chemicals resistance, their application to cardsis being examined. The 1,4-cyclohexanedimethanol derivativecopolymerized polyesters are about 80° C. in glass transitiontemperature and are characteristically excellent also in processability,since they can be thermally fused at low temperatures of about 110 to120° C. when processed into multi-layer sheets. However, because of thelow glass transition temperature, they cannot be used for applicationsrequiring heat resistance. One of methods conventionally considered forimproving the heat resistance of 1,4-cyclohexanedimethanol derivativecopolymerized polyesters is to blend a polymer with a high glasstransition temperature.

[0004] Japanese Patent Laid-Open (Kokai) No. 53-94536 discloses a blendof a polycarbonate and poly(1,4-cyclohexanedimethanolterephthalate-co-isophthalate and a sheet made of it. The blend remainscompatible in a wide range of mixing ratios, and has the transparencypeculiar to the polycarbonate and poly(1,4-cyclohexanedimethanolterephthalate-co-isophthalate). The blend consisting of a polycarbonateand poly(1,4-cyclohexanedimethanol terephthalate-co-isophthalate) and asheet made of it can be certainly improved in heat resistance byincreasing the polycarbonate content. However, if heat resistance isimproved, the processing temperature also rises, and the blend and sheetcould not have both high heat resistance and high processability.

[0005] Japanese Patent Laid-Open (Kokai) No. 59-120648 discloses a blendconsisting of a polycarbonate and a 1,4-cyclohexanedimethanol derivativecopolymerized polyester. The blend can be substantially transparent(when 1,4-cyclohexanedimethanol content is larger), or translucent oropaque (when ethylene glycol content is larger), depending on which of1,4-cyclohexanedimethanol or ethylene glycol is contained more in theglycol component of the 1,4-cyclohexanedimethanol derivativecopolymerized polyester used. However, a substantially transparent blendis difficult to have both high heat resistance and high processability,since the processing temperature rises if the heat resistance isimproved. Furthermore, said Japanese Patent Laid-Open (Kokai) 59-120648does not state anything about the thermal fusibility of the sheet, anddoes not disclose anything about the applicability to a multi-layersheet or cards.

[0006] Moreover, a blend consisting of a polycarbonate and a1,4-cyclohexanedimethanol derivative copolymerized polyester has aproblem that it is not suitable for embossable cards since if thepolycarbonate content is increased, the embossability greatly declinesthough the heat resistance can be improved.

[0007] A polycarbonate alone is excellent in heat resistance, but ispoor in embossability, and has been little examined for application tocards.

[0008] Japanese Patent Laid-Open (Kokai) No. 8-279150 discloses a cardusing non-oriented heat-crystallized polyethylene terephthalate.However, this card has a problem of low embossability though havingexcellent heat resistance.

[0009] The problem of the present invention is to provide cards such asmagnetic cards and IC cards excellent in the balance among heatresistance, processability and embossability, a sheet suitable for suchcards, and a thermoplastic resin composition suitable for such cards andsheet.

Disclosure of the Invention

[0010] The inventors studied intensively to provide cards such asmagnetic cards and IC cards excellent in the balance among heatresistance, processability and embossability, a sheet suitable for suchcards, and a thermoplastic resin composition suitable for such cards andsheet, and as a result, found that a blend consisting of a polycarbonateand a polyester composed of dicarboxylic acid components withterephthalic acid component as a main dicarboxylic acid component andethylene glycol component (I) and 1,4-cyclohexanedimethanol component(II) as main glycol components, with the molar ratio (I)/(II) ofethylene glycol component (I) to 1,4-cyclohexanedimethanol component(II) kept at 1 or more is high in the effect of improving heatresistance at a relatively low load required for card application, andfurthermore that if a polyester composed of dicarboxylic acid componentswith terephthalic acid component as a main dicarboxylic acid component,and ethylene glycol component (I) and 1,4-cyclohexanedimethanolcomponent (II) as main glycol components, with the molar ratio (I)/(II)of ethylene glycol component (I) to 1,4-cyclohexanedimethanol component(II) kept smaller than 1 is further contained, the processability andheat resistance can be further improved. Moreover, it was found that aninorganic sheet-like filler with a specific average grain size is highlyeffective for improving the embossability. Thus, the present inventionhas been completed.

[0011] The present invention is:

[0012] (1) A card, comprising any one of the following thermoplasticresin compositions I to III in its material:

[0013] I. A composition consisting of the following ingredients (A) and(B)

[0014] II. A composition consisting of the following ingredients (A),(B) and (D)

[0015] III. A composition consisting of 100 parts by weight, in total,of the following ingredients (A), (B) and (D) and 2 to 25 parts byweight of the following ingredient (C)

[0016] (In the above I to III,

[0017] the ingredient A is a polyester composed of dicarboxylic acidcomponents with terephthalic acid component as a main dicarboxylic acidcomponent and ethylene glycol component (I) and1,4-cyclohexanedimethanol component (II) as main glycol components, withthe molar ratio (I)/(II) of ethylene glycol component (I) to1,4-cyclohexanedimethanol component (II) kept at 1 or more;

[0018] the ingredient B is an aromatic polycarbonate;

[0019] the ingredient C is an inorganic sheet-like filler of 0.5 to 20μm in average grain size; and

[0020] the ingredient (D) is a polyester composed of dicarboxylic acidcomponents with terephthalic acid component as a main dicarboxylic acidcomponent and ethylene glycol component (I) and1,4-cyclohexanedimethanol component (II) as main glycol components, withthe molar ratio (I)/(II) of ethylene glycol component (I) and1,4-cyclohexanedimethanol component (II) kept at smaller than 1.)

[0021] (2) A card, stated in the above (1), which can electrically,optically or magnetically record readable and writable informationand/or can record information by embossing.

[0022] (3) A card, stated in the above (1) or (2), wherein thethermoplastic resin composition is the composition II with a dispersedstructure in which a phase mainly consisting of the ingredients (A) and(D) exists as a continuous phase.

[0023] (4) A card, stated in the above (1) or (2), wherein thethermoplastic resin composition is the composition II with a dispersedstructure in which a phase mainly consisting of the ingredients (D) and(B) exists as a continuous phase.

[0024] (5) A card, stated in any one of the above (1) through (4),wherein the thermoplastic resin is the composition III.

[0025] (6) A card, stated in any one of the above (1) through (5),wherein the thermoplastic resin composition is a composition consistingof the ingredients (A), (B), (C) and (D) with a dispersed structure inwhich a phase mainly consisting of the ingredients (A) and (D) exists asa continuous phase.

[0026] (7) A card, stated in any one of the above (1) through (5),wherein the thermoplastic resin composition is a composition consistingof the ingredients (A), (B), (C) and (D) with a dispersed structure inwhich a phase mainly consisting of the ingredients (D) and (B) exists asa continuous phase.

[0027] (8) A card, stated in any one of the above (1) through (7), whichis embossed.

[0028] (9) A card, stated in any one of the above (1) through (8),wherein the sheet-like filler is talc.

[0029] (10) A card, stated in any one of the above (1) through (9),which is obtained by processing a sheet.

[0030] (11) A card, stated in any one of the above (1) through (10),which is obtained by processing a multi-layer sheet produced bylaminating a plurality of sheets.

[0031] The present invention is also:

[0032] (12) A sheet, comprising a thermoplastic resin compositionconsisting of the following ingredients (A), (D) and (B):

[0033] Ingredient (A): A polyester composed of dicarboxylic acidcomponents with terephthalic acid component as a main dicarboxylic acidcomponent and ethylene glycol component (I) and1,4-cyclohexanedimethanol component (II) as main glycol components, withthe molar ratio (I)/(II) of ethylene glycol component (I) to1,4-cyclohexanedimethanol component (II) kept at 1 or more

[0034] Ingredient (B): An aromatic polycarbonate

[0035] Ingredient (D): A polyester composed of dicarboxylic acidcomponents with terephthalic acid component as a main dicarboxylic acidcomponent and ethylene glycol component (I) and1,4-cyclohexanedimethanol component (II) as main glycol components, withthe molar ratio (I)/(II) of ethylene glycol component (I) and1,4-cyclohexanedimethanol component (II) kept at smaller than 1.

[0036] (13) A sheet, stated in the above (12), wherein the thermoplasticresin composition has a dispersed structure in which a phase mainlyconsisting of the ingredients (A) and (D) exists as a continuous phase.

[0037] (14) A sheet, stated in the above (12), wherein the thermoplasticresin composition has a dispersed structure in which a phase mainlyconsisting of the ingredients (D) and (B) exists as a continuous phase.

[0038] (15) A sheet, comprising a thermoplastic resin compositionconsisting of 100 parts by weight of one or more thermoplastic resinsselected from the following ingredients (A), (B) and (D) and 2 to 25parts by weight of the following ingredient (C):

[0039] Ingredient (A): A polyester composed of dicarboxylic acidcomponents with terephthalic acid component as a main dicarboxylic acidcomponent and ethylene glycol component (I) and1,4-cyclohexanedimethanol component (II) as main glycol components, withthe molar ratio (I)/(II) of ethylene glycol component (I) to1,4-cyclohexanedimethanol component (II) kept at 1 or more

[0040] Ingredient (B): An aromatic polycarbonate

[0041] Ingredient (C): An inorganic sheet-like filler of 0.5 to 20 μm inaverage grain size

[0042] Ingredient (D): A polyester composed of dicarboxylic acidcomponents with terephthalic acid component as a main dicarboxylic acidcomponent and ethylene glycol component (I) and1,4-cyclohexanedimethanol component (II) as main glycol components, withthe molar ratio (I)/(II) of ethylene glycol component (I) to1,4-cyclohexanedimethanol component (II) kept at smaller than 1.

[0043] (16) A sheet, stated in the above (15), wherein the thermoplasticresin composition consists of 100 parts by weight, in total, of theingredients (A) and (B) and 2 to 25 parts by weight of the ingredient(C).

[0044] (17) A sheet, stated in the above (15), wherein the thermoplasticresin composition consists of 100 parts by weight, in total, of theingredients (A), (D) and (B) and 2 to 25 parts by weight of theingredient (C).

[0045] (18) A sheet, stated in the above (17), wherein the thermoplasticresin composition has a dispersed structure in which a phase mainlyconsisting of the ingredients (A) and (D) exists as a continuous phase.

[0046] (19) A sheet, stated in the above (17), wherein the thermoplasticresin composition has a dispersed structure in which a phase mainlyconsisting of the ingredients (D) and (B) exists as a continuous phase.

[0047] (20) A sheet, stated in any one of the above (15) through (19),wherein the sheet-like filler is talc.

[0048] (21) A multi-layer sheet, comprising a sheet made of athermoplastic resin composition consisting of the following ingredients(A) and (B) at least as one layer:

[0049] Ingredient (A): A polyester composed of dicarboxylic acidcomponents with terephthalic acid component as a main dicarboxylic acidcomponent and ethylene glycol component (I) and1,4-cyclohexanedimethanol component (II) as main glycol components, withthe molar ratio (I)/(II) of ethylene glycol component (I) to1,4-cyclohexanedimethanol component (II) kept at 1 or more

[0050] Ingredient (B): An aromatic polycarbonate

[0051] (22) A multi-layer sheet, stated in the above (21), wherein thethermoplastic resin composition further contains the followingingredient (D):

[0052] Ingredient (D): A polyester composed of dicarboxylic acidcomponents with terephthalic acid component as a main dicarboxylic acidcomponent and ethylene glycol component (I) and1,4-cyclohexanedimethanol component (II) as main glycol components, withthe molar ratio (I)/(II) of ethylene glycol component (I) to1,4-cyclohexanedimethanol component (II) kept at smaller than 1.

[0053] (23) A multi-layer sheet, stated in the above (22), wherein thethermoplastic resin composition has a dispersed structure in which aphase mainly consisting of the ingredients (A) and (D) exists as acontinuous phase.

[0054] (24) A multi-layer sheet, stated in the above (22), wherein thethermoplastic resin composition has a dispersed structure in which aphase mainly consisting of the ingredients (D) and (B) exists as acontinuous phase.

[0055] (25) A multi-layer sheet, stated in any one of the above (21)through (24), which is embossed.

[0056] (26) A multi-layer sheet, comprising a sheet made of athermoplastic resin composition consisting of 100 parts by weight of oneor more thermoplastic resins selected from the ingredients (A), (B) and(D) and 2 to 25 parts by weight of the following ingredient (C):

[0057] Ingredient (A): A polyester composed of dicarboxylic acidcomponents with terephthalic acid component as a main dicarboxylic acidcomponent and ethylene glycol component (I) and1,4-cyclohexanedimethanol component (II) as main glycol components, withthe molar ratio (I)/(II) of ethylene glycol component (I) to1,4-cyclohexanedimethanol component (II) kept at 1 or more

[0058] Ingredient (B): An aromatic polycarbonate

[0059] Ingredient (C): An inorganic sheet-like filler of 0.5 to 20 μm inaverage grain size

[0060] Ingredient (D): A polyester composed of dicarboxylic acidcomponents with terephthalic acid component as a main dicarboxylic acidcomponent and ethylene glycol component (I) and1,4-cyclohexanedimethanol component (II) as main glycol components, withthe molar ratio (I)/(II) of ethylene glycol component (I) and1,4-cyclohexanedimethanol component (II) kept at smaller than 1.

[0061] (27) A multi-layer sheet, stated in the above (26), wherein thethermoplastic resin composition consists of 100 parts by weight, intotal, of the ingredients (A) and (B) and 2 to 25 parts by weight of theingredient (C).

[0062] (28) A multi-layer sheet, stated in the above (26), wherein thethermoplastic resin composition consists of 100 parts by weight, intotal, of the ingredients (A), (D) and (B) and 2 to 25 parts by weightof the ingredient (C).

[0063] (29) A multi-layer sheet, stated in the above (28), wherein thethermoplastic resin composition has a dispersed structure in which aphase mainly consisting of the ingredients (A) and (D) exists as acontinuous phase.

[0064] (30) A multi-layer sheet, stated in the above (28), wherein thethermoplastic resin composition has a dispersed structure in which aphase mainly consisting of the ingredients (D) and (B) exists as acontinuous phase.

[0065] (31) A multi-layer sheet, stated in any one of the above (26)through (30), wherein the sheet-like filler is talc.

[0066] (32) A multi-layer sheet, stated in any one of the above (26)through (31), wherein a sheet made of a thermoplastic resin compositionconsisting of one or more selected from the ingredients (A), (B) and(D), and the ingredient (C) is provided as an inner layer.

[0067] (33) A multi-layer sheet, stated in the above (32), wherein asheet made of a thermoplastic resin composition consisting of theingredients (A) and (B) is provided as a surface layer.

[0068] (34) A multi-layer sheet, stated in the above (33), wherein thethermoplastic resin composition consisting of the ingredients (A) and(B) further contains the ingredient (D).

[0069] (35) A multi-layer sheet, stated in the above (34), wherein thethermoplastic resin composition consisting of the ingredients (A), (B)and (D) has a dispersed structure in which a phase mainly consisting ofthe ingredients (A) and (D) exists as a continuous phase.

[0070] (36) A multi-layer sheet, stated in the above (34), wherein thethermoplastic resin composition consisting of the ingredients (A), (B)and (D) has a dispersed structure in which a phase mainly consisting ofthe ingredients (D) and (B) exists as a continuous phase.

[0071] (37) A multi-layer sheet, stated in any one of the above (26)through (36), which is embossed.

[0072] The present invention is also:

[0073] (38) A card, stated in any one of the above (1) through (9),which is produced by injection molding of the thermoplastic resincomposition.

[0074] The present invention is also:

[0075] (39) A thermoplastic resin composition, comprising the followingingredients (A), (D) and (B):

[0076] Ingredient (A): A polyester composed of dicarboxylic acidcomponents with terephthalic acid component as a main dicarboxylic acidcomponent and ethylene glycol component (I) and1,4-cyclohexanedimethanol component (II) as main glycol components, withthe molar ratio (I)/(II) of ethylene glycol component (I) to1,4-cyclohexanedimethanol component (II) kept at 1 or more

[0077] Ingredient (B): An aromatic polycarbonate

[0078] Ingredient (D): A polyester composed of dicarboxylic acidcomponents with terephthalic acid component as a main dicarboxylic acidcomponent and ethylene glycol component (I) and1,4-cyclohexanedimethanol component (II) as main glycol components, withthe molar ratio (I)/(II) of ethylene glycol component (I) to1,4-cyclohexanedimethanol component (II) kept at smaller than 1.

[0079] (40) A thermoplastic resin composition, stated in the above (39),which has a dispersed structure in which a phase mainly consisting ofthe ingredients (A) and (D) exists as a continuous phase.

[0080] (41) A thermoplastic resin composition, stated in the above (39),which has a dispersed structure in which a phase mainly consisting ofthe ingredients (D) and (B) exists as a continuous phase.

[0081] (42) A thermoplastic resin composition, comprising 100 parts byweight of one or more thermoplastic resin compositions selected from thefollowing ingredients (A), (B) and (D) and 2 to 25 parts by weight ofthe following ingredient (C):

[0082] Ingredient (A): A polyester composed of dicarboxylic acidcomponents with terephthalic acid component as a main dicarboxylic acidcomponent and ethylene glycol component (I) and1,4-cyclohexanedimethanol component (II) as main glycol components, withthe molar ratio (I)/(II) of ethylene glycol component (I) to1,4-cyclohexanedimethanol component (II) kept at 1 or more

[0083] Ingredient (B): An aromatic polycarbonate

[0084] Ingredient (C): An inorganic sheet-like filler of 0.5 to 20 μm inaverage grain size

[0085] Ingredient (D): A polyester composed of dicarboxylic acidcomponents with terephthalic acid component as a main dicarboxylic acidcomponent and ethylene glycol component (I) and1,4-cyclohexanedimethanol component (II) as main glycol components, withthe molar ratio (I)/(II) of ethylene glycol component (I) to1,4-cyclohexanedimethanol component (II) kept at smaller than 1.

[0086] (43) A thermoplastic resin composition, stated in the above (42),which consists of 100 parts by weight, in total, of the ingredients (A)and (B) and 2 to 25 parts of the ingredient (C).

[0087] (44) A thermoplastic resin composition, stated in the above (42),which consists of 100 parts by weight, in total, of the ingredients (A),(D) and (B) and 2 to 25 parts by weight of the ingredient (C).

[0088] (45) A thermoplastic resin composition, stated in the above (44),which has a dispersed structure in which a phase mainly consisting ofthe ingredients (A) and (D) exists as a continuous phase.

[0089] (46) A thermoplastic resin composition, stated in the above (44),which has a dispersed structure in which a phase mainly consisting ofthe ingredients (D) and (B) exists as a continuous phase.

[0090] The Most Preferred Embodiments of the Invention

[0091] A card in the present invention refers to a molded rectangularsheet of 10 mm to 300 mm in long side length and 10 mm to 200 mm inshort side length (the long side length can also be equal to the shortside length, that is, the sheet can also be square) and of 50 to 5000 μmin thickness, and a molded sheet larger than the card in any of thedimensions is called a sheet. A preferable card has a rectangular formof 50 to 100 mm in long side length and 25 to 80 mm in short side lengthand 400 to 2000 μm in thickness, and a more preferable card has arectangular form of about 85 mm in long side length and about 54 mm inshort side length and 600 to 900 μm in thickness.

[0092] The card in the present invention refers to a card which cangenerally record information, and is especially suitable as a card whichcan electrically, optically or magnetically record readable and/orwritable information, and/or can record information by embossing.Specifically, preferable cards include magnetic cards, optical cards,etc. such as a contact type IC card (smart card), non-contact type ICcard with an IC chip embedded in it and magnetically striped card. Inview of applications, the cards include prepaid cards, credit cards,banking cards, various identification cards, etc.

[0093] The cards of the present invention are excellent in the balanceamong heat resistance, processability and embossability and can verypractically endure the use under severe conditions.

[0094] The cards of the present invention can be produced, preferably bymolding a thermoplastic resin composition into a sheet, and cutting itinto cards, or laminating such sheets to form a multi-layer sheet, andcutting it into cards. A sheet secondarily processed by press molding,etc. can also be processed into cards. Furthermore, a thermoplasticresin composition may be melt-kneaded and pelletized, and processed intocards by publicly known press molding, but the production of cards byinjection molding is preferable.

[0095] For production of a sheet, any publicly known methods such as Tdie method and inflation method can be used. The sheet of the presentinvention can be a single-layer sheet or obtained by laminating two ormore sheets of the same or different kinds. For laminating two or moresheets, known methods such as co-extrusion method, heat laminationmethod and hot melt method can be used as desired. Since the sheets ofthe present invention can be thermally fused at a low temperature, heatlamination method can be preferably used.

[0096] The thickness of the sheet in the present invention is notespecially limited. In the case of a single-layer sheet, the thicknessis preferably 50 to 5000 μm, more preferably 100 to 1000 μm. In the caseof a laminate consisting of two or more sheets, the entire thickness ispreferably 150 to 5000 μm, more preferably 300 to 1000 μm. Thethicknesses of respective sheets can be properly decided, depending onthe number of sheets laminated, the entire thickness, decorative effect,etc.

[0097] The thermoplastic resin composition used as the material of thecards and sheets of the present invention is any one of the followingcompositions I to III.

[0098] I. Composition consisting of the following ingredients (A) and(B)

[0099] II. Composition consisting of the following ingredients (A), (B)and (D)

[0100] III. Composition consisting of 100 parts by weight, in total, ofthe following ingredients (A), (B) and (D) and 2 to 25 parts by weightof the following ingredient (C)

[0101] (In the above I to III,

[0102] the ingredient A is a polyester composed of dicarboxylic acidcomponents with terephthalic acid component as a main dicarboxylic acidcomponent and ethylene glycol component (I) and1,4-cyclohexanedimethanol component (II) as main glycol components, withthe molar ratio (I)/(II) of ethylene glycol component (I) to1,4-cyclohexanedimethanol component (II) kept at 1 or more;

[0103] the ingredient B is an aromatic polycarbonate;

[0104] the ingredient C is an inorganic sheet-like filler of 0.5 to 20μm in average grain size; and

[0105] the ingredient (D) is a polyester composed of dicarboxylic acidcomponents with terephthalic acid component as a main dicarboxylic acidcomponent and ethylene glycol component (I) and1,4-cyclohexanedimethanol component (II) as main glycol components, withthe molar ratio (I)/(II) of ethylene glycol component (I) to1,4-cyclohexanedimethanol component (II) kept at smaller than 1.)

[0106] At first, the ingredients (A) through (D) are described below.

[0107] In the present invention, the ingredient (A) is a polyestercomposed of dicarboxylic acid components with terephthalic acidcomponent as a main dicarboxylic acid component and ethylene glycolcomponent (I) and 1,4-cyclohexanedimethanol component (II) as mainglycol components, with the molar ratio (I)/(II) of ethylene glycolcomponent (I) to 1,4-cyclohexanedimethanol component (II) kept at 1 ormore.

[0108] The ingredient (A), preferably, has the molar ratio (I)/(II) ofethylene glycol component (I) to 1,4-cyclohexanedimethanol component(II) kept at 90/10˜60/40, more preferably 75/25˜65/35 in the glycolcomponents, and contains terephthalic acid as an acid component.

[0109] In the present invention, the ingredient (D) is a polyestercomposed of dicarboxylic acid components with terephthalic acidcomponent as a main dicarboxylic acid component and ethylene glycolcomponent (I) and 1,4-cyclohexanedimethanol component (II) as mainglycol components, with the molar ratio (I)/(II) of ethylene glycolcomponent (I) to 1,4-cyclohexanedimethanol component (II) kept atsmaller than 1.

[0110] The ingredient (D), preferably, has the molar ratio (I)/(II) ofethylene glycol component (I) to 1,4-cyclohexanedimethanol component(II) at ⅔ or less in the glycol components, and can contain isophthalicacid component in addition to terephthalic acid component as acidcomponents. More preferably, it has the molar ratio (I)/(II) of ethyleneglycol component (I) to 1,4-cyclohexanedimethanol component (II) kept at30/70˜40/60, and contains terephthalic acid component as an acidcomponent.

[0111] In the present invention, the method for producing the1,4-cyclohexanedimethanol derivative copolymerized polyesters used asthe ingredients (A) and (D) is not especially limited. For example, theycan be produced by polycondensing terephthalic acid or any of its loweralkyl esters, 1,4-cyclohexanedimethanol and ethylene glycol in thepresence of absence of a catalyst such as an organic titanium compound.As the polymerization conditions, for example, the conditions stated inU.S. Pat. No. 2,901,466 can be applied.

[0112] In the present invention, the 1,4-cyclohexanedimethanolderivative copolymerized polyesters used as the ingredients (A) and (D)can have usually 20 mol % or less, preferably 10 mol % or less ofanother dicarboxylic acid such as isophthalic acid, orthophthalic acid,2,6-naphthalenedicarboxylic acid, 2,7-naphthalenedicarboxylic acid,1,5-naphthalenedicarboxylic acid, methylterephthalic acid,4,4′-biphenyldicarboxylic acid, 2,2′-biphenyldicarboxylic acid,1,2′-bis(4-carboxyphenoxy)-ethane, succinic acid, adipic acid, subericacid, azelaic acid, sebacic acid, dodecanedionic acid,octadecanedicarboxylic acid, dimeric acid or 1,4-cyclohexanedicarboxylicacid as another acid component, and another glycol such as propyleneglycol, 1,5-pentanediol, 1,6-hexanediol, 1,8-octanediol,1,10-decanediol, 1,3-cyclohexanedimethanol, 1,2-cyclohexanedimethanol or2,2-bis(2′-hydroxyethoxyphenyl)propane as another glycol component,respectively copolymerized, as far as the effect of the presentinvention is not impaired.

[0113] The aromatic polycarbonate used as the ingredient (B) in thepresent invention is preferably produced with at least one or moreselected from 2,2′-bis(4-hydroxyphenyl)propane (bisphenol A), 4,4′-dihydroxydiphenylsulfone and 4,4′-dihydroxydiphenyl ether as a main rawmaterial, and among them, an aromatic polycarbonate produced withbisphenol A as a main raw material is preferable. Concretely, apolycarbonate obtained by the ester interchange method or phosgenemethod using said bisphenol A as a dihydroxy component is preferable.Furthermore, a polycarbonate obtained by using bisphenol A partially(preferably by 10 mol % or less) substituted by 4,4′-dihydroxydiphenylalkane, 4,4′-dihydroxydiphenylsulfone or4,4′-dihydroxydiphenyl ether, etc. is also preferable.

[0114] In the present invention, the inorganic sheet-like filler as theingredient (C) is preferably a filler of three-dimensionally anisotropicand biaxially oriented grains. It can be selected, for example, fromtalc, kaolin, mica, sericite, basic magnesium carbonate, aluminumhydroxide, glass flakes, etc. Two or more of these fillers can also beused together. Among these fillers, talc and kaolin are preferable, andtalc is most preferable.

[0115] The average grain size of the inorganic sheet-like filler ispreferably, 0.5 to 20 μm, more preferably 1 to 10 μm in the stage beforemixing. If the grain size is in this range, the moldability of thethermoplastic resin composition into a sheet and cards is good, and theeffect for improving embossability is high. Furthermore, transparency isalso excellent.

[0116] The average grain size of the inorganic sheet-like filler can bemeasured by the centrifugal precipitation method.

[0117] The inorganic sheet-like filler can also be treated on thesurfaces of its grains by a coupling agent such as an isocyanate basedcompound, organic silane based compound, organic titanate basedcompound, organic borane based compound or epoxy compound.

[0118] The compositions I to III are described below.

[0119] The composition I consists of the ingredients (A) and (B). Thecomposition I is good in heat resistance and allows thermal fusion at arelatively low temperature. Therefore, the composition is especiallyuseful as a material to be used as at least one layer of a multi-layersheet, and is also suitable for cards obtained by processing it.

[0120] The mixing ratio of the ingredients (A) and (B) in thecomposition I is not especially limited, and in the case of a dispersedstructure in which the ingredient (A) exists as a continuous phase or inthe case of a dispersed structure in which the ingredient (B) exists asa continuous phase, the composition can have both high heat resistanceand high processability. In a dispersed structure, it can happen thatthe ingredient (3) exists as a dispersed phase in a continuous phaseformed by the ingredient (A), or that both the ingredients (A) and (B)exist as continuous phases, or that the ingredient (A) exists as adispersed phase in a continuous phase formed by the ingredient (B). Adispersed structure refers to any multi-phase structure other than asingle phase.

[0121] As for the mixing ratio in this case, it is preferable that theamount of the ingredient (A) is 10 to 90 wt % while the amount of theingredient (B) is 90 wt % to 10 wt % based on the total weight of theingredients (A) and (B). In this mixing ratio range, cards and amulti-layer sheet excellent in both heat resistance and processabilitycan be obtained. Especially if the amount of the ingredient (A) is 50 to90 wt % while the amount of the ingredient (B) is 50 to 10 wt %, theingredient (A) is likely to form a continuous phase, and thethermoplastic resin composition allows thermal fusion at a lowtemperature of 110 to 130° C. On the other hand, if the amount of theingredient (A) is 10 to 50 wt % while the amount of the ingredient (B)is 90 to 50 wt %, the ingredient (B) is likely to form a continuousphase, and the thermoplastic resin composition allows thermal fusion ata practical temperature of 130 to 150° C. even though excellent in heatresistance.

[0122] The composition II consists of the ingredients (A), (B) and (D).The composition is preferably further higher in processability and heatresistance than the composition I, since it further contains theingredient (D).

[0123] The mixing ratio of the respective ingredients in the compositionII is not especially limited. In the case of a dispersed structure inwhich a phase mainly consisting of the ingredients (A) and (B) exists asa continuous phase or in the case of a dispersed structure in which aphase mainly consisting of the ingredients (B) and (D) exists as acontinuous phase, heat resistance is especially high. In such adispersed structure, it can happen that a phase mainly consisting of theingredients (B) and (D) exists as a dispersed phase in a continuousphase mainly consisting of the ingredients (A) and (D), or that a phasemainly consisting of the ingredients (A) and (D) and a phase mainlyconsisting of the ingredients (B) and (D) exist as continuous phases, orthat a phase mainly consisting of the ingredients (A) and (D) exist as adispersed phase in a continuous phase mainly consisting of theingredients (B) and (D).

[0124] In this case, as for the amounts of the respective ingredients,the amount of the ingredient (B) is preferably 10 to 900 parts byweight, more preferably 20 to 500 parts by weight based on 100 parts byweight in total of the ingredients (A) and (D).

[0125] Especially when the amount of the ingredient (B) is 10 to 100parts by weight based on 100 parts by weight in total of the ingredients(A) and (D), a dispersed structure in which a phase mainly consisting ofthe ingredients (A) and (D) exists as a continuous phase is likely to beobtained, and high processability can be assured preferably.Furthermore, if the amount of the ingredient (B) is more than 100 partsby weight to 900 parts by weight based on 100 parts by weight in totalof the ingredients (A) and (D), a dispersed structure in which a phasemainly consisting of the ingredients (B) and (D) exists as a continuousphase is likely to be obtained, and higher heat resistance can beassured preferably.

[0126] In this case, the ratio by weight (A)/(D) of the ingredient (A)to the ingredient (D) is preferably 90/10˜ 30/70, more preferably80/20˜50/50, and in this range, an especially good dispersed structurecan be obtained.

[0127] The composition III consists of 100 parts by weight of one ormore selected from the ingredients (A), (B) and (D), and 2 to 25 partsby weight of the ingredient (C). Since the composition III contains theingredient (C), embossability is greatly improved preferably withoutlowering heat resistance and processability.

[0128] In the composition III, it is preferable to use at least theingredient (A) or (D), especially the ingredient (A). Furthermore, it ispreferable to use at least two or more of the ingredients (A), (B) and(D).

[0129] Especially preferable combinations for the compound III include acomposition consisting of the ingredients (A), (B) and (C) and acomposition consisting of the ingredients (A), (B), (C) and (D). Amongthem, a composition consisting of the ingredients (A), (B), (C) and (D)is especially preferable.

[0130] The amount of the ingredient (C) is 2 to 25 parts by weight,preferably 4 to 15 parts by weight based on 100 parts by weight in totalof the ingredients (A), (B) and (D) (if any ingredient is not contained,the amount of the ingredient is 0 part by weight for calculating thetotal amount). If the amount is in this range, moldability is good, anda good sheet and cards can be obtained. Furthermore, the effect forimproving embossability is high, and transparency is also excellent.

[0131] When two or more are selected from the ingredients (A), (B) and(D), the ratio of the respective ingredients is optional. When theingredients (A) and (B) are used together, or when all of theingredients (A), (B) and (D) are used together, the preferable mixingratios and modes stated for the above compositions I and II can beadopted.

[0132] In the present invention, the method for blending the respectiveingredients is not especially limited, and any publicly known method canbe used. Specifically a single-screw or double-screw extruder can beused for homogenous melt-kneading. As another method, specificingredients only can be preliminarily kneaded, and the kneaded mixtureas a masterbatch can be kneaded with the remaining ingredients.

[0133] The composition of the present invention can also contain othervarious additives as far as the object of the present invention is notimpaired. These other additives include a reinforcing material such asglass fibers, carbon fibers, asbestos fibers, rock wool, calciumcarbonate, quartz sand, bentonite, clay, wollastonite, barium sulfate,glass beads, mica and titanium oxide, filler, antioxidant (phosphorusbased, sulfur based, etc.), ultraviolet absorbent, thermal stabilizer(hindered phenol based, etc.), lubricant, releasing agent, antistaticagent, anti-blocking agent, colorant including dye and pigment, flameretarder (halogen based, phosphorus based, etc.), flame retarding aid(antimony compound such as antimony trioxide, zirconium oxide,molybdenum oxide, etc.), foaming agent, crosslinking agent (e.g.,polyepoxy compound, isocyanate compound, acid anhydride, etc.), etc.Furthermore, any other synthetic resin (e.g., polyamide resin,polystyrene resin, acrylic resin, polyethylene resin, ethylene/vinylacetate copolymer, phenoxy resin, epoxy resin, silicone resin, etc.) canalso be contained.

[0134] The thermoplastic resin composition can be made opaque by adding,for example, titanium oxide, etc. When it is used as cards capable ofrecording information such as magnetic cards and IC cards, usually 2 to25 parts by weight of titanium oxide can be added based on 100 parts byweight, in total, of the ingredients (A) to (D), for making thecomposition opaque.

[0135] The thermoplastic resin composition can be molded into a sheet,and such sheets can be further laminated into a multi-layer sheet.

[0136] In the case of a multi-layer sheet, at least one layer is formedby said composition I, II or III. As the composition III, athermoplastic resin composition consisting of 100 parts by weight of oneor more selected from the ingredients (A), (B) and (D) and 2 to 25 partsby weight of the ingredient (C) is preferable, and especially, athermoplastic resin composition consisting of 100 parts by weight, intotal, of the ingredients (A) and (B) and 2 to 25 parts by weight of theingredient (C), and a thermoplastic resin composition consisting of 100parts by weight, in total, of the ingredients (A), (B) and (D) and 2 to25 parts by weight of the ingredient (C) are preferable.

[0137] Other preferable modes are also the same as described in detailfor the compositions I to III.

[0138] The materials of the other layers are not especially limited, andsuch materials as paper, cloth and synthetic resins (e.g., polyolefinresins, polyamide resins, polyimide resins, polyester resins, polyvinylchloride resin, vinyl chloride/vinyl acetate copolymer resin, ABS resin,etc.) can be used. Between the respective layers, as required, anadhesive layer can also be formed. Furthermore, the respective layerscan be printed, and also be coated with a magnetic material. Themagnetic layer can exist over the entire sheet or partially on the sheetas stripes.

[0139] To produce a multi-layer sheet of the present invention by heatlamination, sheets of a material to allow thermal fusion in atemperature range of 110 to 150° C., for example, amorphous polyestersheets can be preferably used.

[0140] An amorphous polyester can be a polyester of 5 cal/g or less incrystallization calorie when cooled from a molten state at a rate of 10°C./min by a differential scanning calorimeter.

[0141] The amorphous polyester sheets to be laminated can be sheets ofan amorphous polyester alone or of a composition containing an amorphouspolyester. The amorphous polyester can be selected from amorphouspolyethylene terephthalate, polyethylene terephthalate copolymer,1,4-cyclohexanedimethanol derivative copolymerized polyesters, etc. Anyof these amorphous polyesters can be used as a mixture with anotheramorphous polymer. The amorphous polymer can be an aromaticpolycarbonate or amorphous polyester, etc., and among them, an aromaticpolycarbonate is preferable. The amount of the amorphous polymer to beadded is preferably 10 to 90 wt %.

[0142] The multi-layer sheet of the present invention consists of two ormore layers. It is preferable that the thickness of the sheet made ofthe composition I, the sheet made of the composition II or the sheetmade of the composition III is at least 50% or more of all the sheets.It is more preferable that all the sheets are sheets made of thecomposition I, sheets made of the composition II or sheets made of thecomposition III, and these laminated sheets can be of the same materialor different materials.

[0143] If a sheet not containing the ingredient (C) is used as thesurface layer, the multi-layer sheet is preferably excellent inappearance since the sheet is very excellent in transparency. A sheetcontaining the ingredient (C) is suitable for cards, since it is veryexcellent in embossability. Therefore, If a sheet made of thecomposition III as a sheet containing the ingredient (C) is used as aninner layer and a sheet made of the composition I or II is used as thesurface layer, the multi-layer sheet is excellent in both heatresistance and embossability.

EXAMPLES

[0144] The effects of the present invention are described further belowin reference to examples.

Examples 1 to 8

[0145] The raw materials stated in Table 1 were dry-blended at a ratiostated in Table 1, using a V blender, and the blend was fed unto anextruder, and discharged from a T die, to obtain sheets of 100 μm and600 μm in thickness. The sheet-like filler was preliminarily kneaded,and supplied as a masterbatch.

[0146] The sheets of 100 μm and 600 μm in thickness were fed into apress molding machine, and held at the temperature stated in Table 1 ata pressure of 1 MPa for 10 minutes, to be thermally fused, and theadhesiveness was examined. In Table 1, a laminate which could beseparated by hand was expressed by x, and a laminate which could not beseparated by hand, by o. The ingredient (A) used was a polyesterconsisting of terephthalic acid component, ethylene glycol component and1,4-cyclohexanedimethanol component, with the molar ratio (I)/(II) ofethylene glycol component (I) to 1,4-cyclohexanedimethanol component(II) kept at about 70/30 (“Easter” GN071 produced by Eastman Chemical).The ingredient (B) used was “Yupiron” S3000 produced by MitsubishiEngineering Plastics K.K. The ingredient (C) used was talc LMS-300produced by Fuji Talc Kogyo K.K. (1.4 μm in average grain size). Theingredient (D) used was a polyester consisting of terephthalic acidcomponent, ethylene glycol component and 1,4-cyclohexanedimethanolcomponent, with the molar ratio (I)/(II) of ethylene glycol component(I) to 1,4-cyclohexanedimethanol component (II) kept at about 35/65(“Easter” DN003 produced by Eastman Chemical).

[0147] The dispersion mode of the two-layer sheet was observed by atransmission electron microscope, and the observed mode is shown inTable 1.

Comparative Examples 1 to 4

[0148] Two-layer sheets were produced as described in Examples 1, 2, 5and 6, except that poly(1,4-cyclohexanedimethanolterephthalate-co-isophthalate) was used as the ingredient (A) instead ofthe polyester consisting of terephthalic acid component, ethylene glycolcomponent and 1,4-cyclohexanedimethanol component, with the molar ratio(I)/(II) of ethylene glycol component (I) to 1,4-cyclohexanedimethanolcomponent (II) kept at about 70/30, and the adhesiveness was examinedunder the same conditions as in Example 1. TABLE 1 Dispersion modeFusion Adhesiveness Composition Continuous Dispersed temperature betweenthe A(wt %) B(wt %) C(wt %) D(wt %) E(wt %) phase phase (° C.) samesheets Example 1 70 30 — — — A B 120  Example 2 35 30 — 35 — A + D B +D 120  Example 3 63 27 10 — — A + C B + D 120  Example 4 40 27 10 23 —A + D + C B + D + C 120  Example 5 30 70 — — — B A 145  Example 6 1570 — 15 — B + D A + D 145  Example 7 27 63 10 — — B + C A + C 145 Example 8 18 63 10  9 — B + D + C A + D + C 145  Comparative — 30 — —70 Single phase 120 X example 1 Comparative — 30 — 35 35 Single phase120 X example 2 Comparative — 70 — — 30 Single phase 145 X example 3Comparative — 70 — 15 15 Single phase 145 X example 4

Comparative Example 5

[0149] A 1 mm thick hard polyvinyl chloride sheet (Takiron ESS8800A) wasfed into a press molding machine, to produce sheets of 100 μm and 600 μmin thickness at a temperature of 230° C. and at a pressure of 1 MPa.

[0150] The sheets of 100 μm and 600 μm in thickness were fed into apress molding machine, and held at a temperature of 120° C. and at apressure of 1 MPa for 10 minutes, to be thermally fused. Theadhesiveness was examined. The two-layer sheet had not been fused, andcould be separated.

Examples 9 to 13, and Comparative Examples 6 and 7

[0151] The raw materials stated in Table 2 were dry-blended at a ratiostated in Table 2 using a V blender, and the blend was fed into anextruder and pelletized at 270° C., to obtain a thermoplastic resincomposition. The thermoplastic resin composition was molded into 100mm×100 mm×0.8 mm cards by press molding at a temperature of 230° C. andat a pressure of 1 MPa.

[0152] From the cards, specimens of 85 mm×54 mm were cut out, toevaluate heat resistance by a heat sag test. Specifically, a one-endarea of 20 mm×54 mm was supported horizontally in a hot air oven of 105°C., and 60 minutes later, the sag distance at the tip of the specimenwas measured. TABLE 2 Sheet Defor- Composition lamin- mation A B C Dation in heat sag (wt %) (wt %) (wt %) (wt %) mode test (mm) Example 9 35 30 — 35 Single  7 sheet Example 10  50 30 — 20 Single  9 sheetExample 11  63 27 10 — Single 18 sheet Example 12  32 27 10 31 Single  5sheet Example 13  45 27 10 18 Single  7 sheet Comparatve — 30 — 70Single 43 example 6 sheet Comparative 100 — — — Single Vertical example7 sheet sag

Examples 14 to 18, and Comparative Examples 8 and 9

[0153] The raw materials stated in Table 3 were dry-blended at a ratiostated in Table 3 using a V blender, and the blend was fed into anextruder and pelletized at 270° C., to obtain a thermoplastic resincomposition. The thermoplastic resin composition was molded into cardsof 100 mm×100 mm×0.8 mm by press molding at a temperature of 230° C. andat a pressure of 1 MPa.

[0154] From the cards, specimens of 85 mm×54 mm were cut out, toevaluate heat resistance by a heat sag test. Specifically, a one-endarea of 20 mm×54 mm was supported horizontally in a hot air oven of 135°C., and 60 minutes later, the sag distance at the tip of the specimenwas measured. TABLE 3 Sheet Defor- Composition lamin- mation A B C Dation in heat sag (wt %) (wt %) (wt %) (wt %) mode test (mm) Example 14 15 70 — 15 Single  2 sheet Example 15  25 70 —  5 Single  1 sheetExample 16  27 63 10 — Single 10 sheet Example 17  14 63 10 13 Single  1sheet Example 18  23 63 10  4 Single  1 sheet Comparative — 70 — 30Single 38 example 8 sheet Comparative 100 — — — Single Vertical example9 sheet sag

Examples 19 to 26, and Comparative Example 10

[0155] The raw materials stated in Table 4 were dry-blended at a ratiostated in Table 4 using a V blender, and the blend was fed into anextruder, and discharged from a T die, to obtain sheets of 100 μm and300 μm in thickness.

[0156] The sheets of 100 μm and 300 μm in thickness were overlapped inthe order of 100/300/300/100 μm (“/” expresses lamination), and thelaminate was fed into a press molding machine and held at a temperatureof 120° C. and at a pressure of 1 MPa for 10 minutes, to be thermallyfused. In Examples 19 to 24, sheets of the same kind were laminated. InExamples 25 and 26, sheets containing an inorganic sheet-like fillerwere used as the inner layers and sheets not containing any inorganicsheet-like filler were used as the surface layers.

[0157] From the four-layer sheet, specimens of 85 mm×54 mm× 0.8 mm werecut out, to evaluate heat resistance by a heat sag test. Specifically, aone-end area of 20 mm×54 mm was supported horizontally in a hot air ovenof 105° C., and 60 minutes later, the sag distance at the tip of thespecimen was measured. TABLE 4 Sheet Deformation Composition laminationin heat sag A(wt %) B(wt %) C(wt %) D(wt %) mode test (mm) Example 19 7030 — — Multi-layer 19 sheet Example 20 35 30 — 35 Multi-layer 6 sheetExample 21 50 30 — 20 Multi-layer 8 sheet Example 22 63 27 10 —Multi-layer 18 sheet Example 23 32 27 10 31 Multi-layer 4 sheet Example24 45 27 10 18 Multi-layer 6 sheet Example Surface 70 30 — — Multi-layer18 25 layer sheet Inner 63 27 — — Multi-layer layer sheet ExampleSurface 50 30 10 20 Multi-layer 7 26 layer sheet Inner 45 27 10 18Multi-layer layer sheet Comparative — 30 — 70 Single 43 example 6 sheetComparative 100  — — — Multi-layer Vertical example 10 sheet sag

Examples 27 to 34, and Comparative Example 11

[0158] The raw materials stated in Table 5 were dry-blended at a ratiostated in Table 5 using a V blender, and the blend was fed into anextruder, and discharged from a T die, to obtain sheets of 100 μm and300 μm in thickness.

[0159] The sheets of 100 μm and 300 μm in thickness were overlapped inthe order of 100/300/300/100 μm (“/” expresses lamination), and thelaminate was fed into a press molding machine and held at a temperatureof 145° C. and at a pressure of 1 MPa for 10 minutes, to be thermallyfused. In Examples 27 to 32, sheets of the same kind were laminated. InExamples 33 and 34, sheets containing an inorganic sheet-like fillerwere used as the inner layers, and sheets not containing any inorganicsheet-like filler were used as the surface layers.

[0160] From the four-layer sheet, specimens of 85 mm×54 mm× 0.8 mm werecut out, to evaluate heat resistance by a heat sag test. Specifically, aone-end area of 20 mm×54 mm was supported horizontally in a hot air ovenof 135° C., and 60 minutes later, the sag distance at the tip of thespecimen was measured. TABLE 5 Sheet Deformation Composition laminationin heat sag A(wt %) B(wt %) C(wt %) D(wt %) mode test (mm) Example 27 3070 — — Multi-layer 12 sheet Example 28 15 70 — 15  Multi-layer 2 sheetExample 29 25 70 — 5 Multi-layer 1 sheet Example 30 27 63 10 —Multi-layer 8 sheet Example 31 14 63 10 13  Multi-layer 1 sheet Example32 23 63 10 4 Multi-layer 1 sheet Example Surface 30 70 — — Multi-layer10 33 layer sheet Inner 27 63 10 — Multi-layer layer sheet ExampleSurface 25 70 — 5 Multi-layer 1 34 layer sheet Inner 23 63 10 4Multi-layer layer sheet Comparative — 70 — 30  Single 38 example 8 sheetComparative 100  — — — Multi-layer Vertical example 11 sheet sag

Examples 35 to 39, and Comparative Examples 12 and 13

[0161] The raw materials stated in Table 6 were dry-blended at a ratiostated in Table 6 using a V blender, and the blend was fed into anextruder and pelletized at 270° C., to obtain a thermoplastic resincomposition. The thermoplastic resin composition was fed into aninjection molding machine, and molded into cards of 85 mm×54 mm×0.8 mmat a processing temperature of 275° C. and at a mold temperature of 60°C.

[0162] A one-end area of 20 mm×54 mm of a specimen was supportedhorizontally in a hot air oven of 105° C., and 60 minutes later, the sagdistance at the tip of the specimen was measured. TABLE 6 Defor- mationComposition in heat sag A(wt %) B(wt %) C(wt %) D(wt %) test (mm)Example 35  35 30 — 35  8 Example 36  50 30 — 20 10 Example 37  63 27 10— 18 Example 38  32 27 10 31  6 Example 39  45 27 10 18  8 Comparative —30 — 70 45 example 12 Comparative 100 — — — Vertical example 13 sag

Examples 40 to 44, and Comparative Examples 14 and 15

[0163] The raw materials stated in Table 7 were dry-blended at a ratiostated in Table 7 using a V blender, and the blend was fed into anextruder and pelletized at 270° C., to obtain a thermoplastic resincomposition. The thermoplastic resin composition was fed into aninjection molding machine, and molded into cards of 85 mm×54 mm×0.8 mmat a processing temperature of 275° C. and at a mold temperature of 60°C.

[0164] A one-end area of a specimen was supported horizontally in a hotair oven of 135° C., and 60 minutes later, the sag distance at the tipof the specimen was measured. TABLE 7 Defor- mation Composition in heatsag A(wt %) B(wt %) C(wt %) D(wt %) test (mm) Example 40  15 70 — 15  2Example 41  25 70 —  5  1 Example 42  27 63 10 — 12 Example 43  14 63 1013  1 Example 44  23 63 10  4  1 Comparative — 70 — 30 40 example 14Comparative 100 — — — Vertical example 15 sag

Examples 45 to 49, and Comparative Examples 16 to 18

[0165] The raw materials stated in Table 8 were dry-blended at a ratiostated in Table 8 using a V blender, and the blend was fed into anextruder and discharged from a T die, to obtain sheets of 100 μm and 300μm in thickness.

[0166] The sheets of 100 μm and 300 μm were overlapped in the order of100/300/300/100 μm (“/” expresses lamination), and the laminate was fedinto a press molding machine and held at a pressure of 1 MPa for 10minutes, to be thermally fused, thus obtaining cards of 85 mm×54 mm×0.8mm.

[0167] The cards were embossed using a manual embosser (NE-1600 producedby Nippon Jikensha), and the warping of the cards was measured accordingto JIS X 6301.

[0168] In Examples 45 and 46 and Comparative Examples 16 and 17, cardswere produced at a sheet molding temperature of 250° C. and at a thermalfusion temperature of 120° C. In Comparative Example 18, cards wereproduced at a sheet molding temperature of 270° C. and at a thermalfusion temperature of 200° C. In Examples 47 to 49, cards were producedat a sheet molding temperature of 260° C. and at a thermal fusiontemperature of 200° C. TABLE 8 Composition A(parts B(parts C(partsD(parts Warping of by by by by card weight) weight) weight) weight) (mm)Example 45 100 — 11 — 1.4 Example 46 — — 11 100 1.5 Example 47  50  5011 — 1.6 Example 48 —  50 11  50 1.7 Example 49  25  50 11  25 1.6Comparative 100 — — — 1.9 example 16 Comparative — — — 100 2.0 example17 Comparative — 100 — — 2.9 example 18

Examples 50 to 54, and Comparative Examples 19 to 21

[0169] The raw materials stated in Table 9 were dry-blended at a ratiostated in Table 9 using a V blender, and the blend was melt-kneaded andpelletized by a double-screw extruder, to obtain a resin composition.The composition was fed into an injection molding machine, to mold cardsin conformity with JIS X 6301.

[0170] The cards were embossed using a manual embosser (NE-1600 producedby Nippon Jikensha), and the warping of cards was measured according toJIS X 6301.

[0171] In Examples 50 and 51 and Comparative Examples 19 and 20, cardswere produced at a processing temperature of 270° C. and at a moldtemperature of 40° C. In Comparative Example 21, cards were produced ata processing temperature of 280° C. and at a mold temperature of 90° C.In Examples 52 to 54, cards were produced at a processing temperature of275° C. and at a mold temperature of 60° C. TABLE 9 Composition A(partsB(parts C(parts D(parts Warping of by by by by card weight) weight)weight) weight) (mm) Example 50 100 — 11 — 1.5 Example 51 — — 11 100 1.5Example 52  50  50 11 — 1.7 Example 53 —  50 11  50 1.7 Example 54  25 50 11  25 1.7 Comparative 100 — — — 2.0 example 19 Comparative — — —100 2.0 example 20 Comparative — 100 — — 3.0 example 21

Examples 55 to 58, and Comparative Examples 22 and 23

[0172] The raw materials stated in Table 10 were dry-blended at a ratiostated in Table 10 using a V blender, and the blend was fed into anextruder set at 260° C. and discharged from a T die, to obtain sheets of100 μm and 300 μm in thickness.

[0173] The sheets of 100 μm and 300 μm were overlapped in the order of100/300/300/100 μm (“/” expresses lamination), and the laminate was fedinto a press molding machine and held at a pressure of 1 MPa for 10minutes, to be thermally fused, thus obtaining cards of 85 mm×54 mm×0.8mm.

[0174] The cards were embossed using a manual embosser (NE-1600 producedby Nippon Jikensha), and the warping of cards was measured according toJIS X 6301.

[0175] In Examples 55 and 56 and Comparative Examples 22 and 23, cardswere produced at a sheet molding temperature of 250° C. and at a thermalfusion temperature of 120° C. In Examples 57 and 58, cards were producedat a sheet molding temperature of 260° C. and at a thermal fusiontemperature of 200° C.

[0176] In Comparative Example 23, though the warping was small, the meltkneadability was low and the sheet discharge stability was poor. So,moldability was remarkably low. TABLE 10 Composition A(parts B(partsC(parts D(parts Warping by by by by of Mold- weight) weight) weight)weight) card (mm) ability Example 55 100 —  2 — 1.8 ∘ Example 45 100 —11 — 1.4 ∘ Example 56 100 — 25 — 1.0 ∘ Example 57  25 50  2 25 2.0 ∘Example 49  25 50 11 25 1.6 ∘ Example 58  25 50 25 25 1.2 ∘ Comparative100 —  1 — 1.9 ∘ example 22 Comparative 100 — 30 — 0.9 x example 23

Examples 59 and 60, and Comparative Examples 24 and 25

[0177] The raw materials stated in Table 11 were dry-blended at a ratiostated in Table 11 using a V blender, and the blend was fed into anextruder set at 260° C., and discharged from a T die, to obtain sheetsof 100 μm and 300 μm in thickness.

[0178] In Example 59, as an inorganic sheet-like filler, kaolin (burnedkaolin “Satintone” 5 of 0.8 μm in average grain size produced by HayashiKasei K.K.). In Comparative Example 24, as an inorganic sphericalfiller, silica (“Nipseal” E150K produced by Nippon Silica Kogyo K.K.)was used. In Comparative Example 25, as an inorganic needle-like filler,wollastonite (“NYAD G” produced by Nyco Minerals) was used.

[0179] The sheets of 100 μm and 300 μm were overlapped in the order of100/300/300/100 μm (“/” expresses lamination), and fed into a pressmolding machine, and held at a temperature of 200° C. and at a pressureof 1 MPa for 10 minutes, to obtain cards in conformity with JIS X 6301.

[0180] The cards were embossed by a manual embosser (NE-1600 produced byNippon Jikensha), and the warping of cards was measured according to JISX 6301. TABLE 11 Composition C (parts by weight) Sheet- Sheet- Needle- AB like like Spherical like D (parts by (parts by filler filler fillerfiller (parts by Warping of weight) weight) (talc) (kaolin) (silica)(wollastonite) weight) card (mm) Example 45 100 — 11 — — — — 1.4 Example46 100 — — 11 — — — 1.5 Example 47 25 50 11 — — — 25 1.6 Example 48 2550 — 11 — — 25 1.7 Comparative 100 — — — 11 — — 2.0 example 24Comparative 100 — — — — 11 — 1.9 example 25

Examples 61 to 64, and Comparative Example 26

[0181] The raw materials stated in Table 12 were blended at a ratiostated in Table 12 using a V blender, and the blend was fed into anextruder set at 260° C. and discharged from a T die, to obtain sheets of100 μm and 300 μm in thickness.

[0182] In Examples 61 and 63, as an inorganic sheet-like filler, talc of5.5 μm in average grain size (PKP-80 produced by Fuji Talc Kogyo K.K.)was used. In Examples 62 and 64, as an inorganic sheet-like filler, talcof 12.0 μm in average grain size (NK48 produced by Fuji Talc Kogyo K.K.)was used. In Comparative Example 26, as an inorganic sheet-like filler,talc of 24.5 μm in average grain size (Supercut 15 produced by Fuji TalcKogyo K.K.) was used.

[0183] The sheets of 100 μm and 300 μm were overlapped in the order of100/300/300/100 μm (“/” expresses lamination), and the laminate was fedinto a press molding machine and held at a temperature of 200° C. and ata pressure of 1 MPa for 10 minutes, to be thermally fused, thusobtaining cards in conformity with JIS X 6301.

[0184] The cards were embossed using a manual embosser (NE-1600 producedby Nippon Jikensha), and the warping of cards was measured according toJIS X 6301. TABLE 12 Composition C (parts by weight) Average AverageAverage Average A B grain grain grain grain D (parts by (parts by sizesize size size (parts by Warping of weight) weight) 1.4 μm 5.5 μm 12 μm24.5 μm weight) card (mm) Example 45 100 — 11 — — — — 1.4 Example 61 100— — 11 — — — 1.1 Example 62 100 — — — 11 — — 1.4 Example 49 25 50 11 — —— 25 1.6 Example 63 25 50 — 11 — — 25 1.3 Example 64 25 50 — — 11 — 251.6 Comparative 100 — — — — 11 — 1.9 example 26

1. A card, comprising any one of the following thermoplastic resincompositions I to III in its material: I. A composition consisting ofthe following ingredients (A) and (B) II. A composition consisting ofthe following ingredients (A), (B) and (D) III. A composition consistingof 100 parts by weight of one or more selected from the followingingredients (A), (B) and (D) and 2 to 25 parts by weight of thefollowing ingredient (C) (In the above I to III, the ingredient A is apolyester composed of dicarboxylic acid components with terephthalicacid component as a main dicarboxylic acid component and ethylene glycolcomponent (I) and 1,4-cyclohexanedimethanol component (II) as mainglycol components, with the molar ratio (I)/(II) of ethylene glycolcomponent (I) to 1,4-cyclohexanedimethanol component (II) kept at 1 ormore; the ingredient B is an aromatic polycarbonate; the ingredient C isan inorganic sheet-like filler of 0.5 to 20 μm in average grain size;and the ingredient (D) is a polyester composed of dicarboxylic acidcomponents with terephthalic acid component as a main dicarboxylic acidcomponent and ethylene glycol component (I) and1,4-cyclohexanedimethanol component (II) as main glycol components, withthe molar ratio (I)/(II) of ethylene glycol component (I) to1,4-cyclohexanedimethanol component (II) kept at smaller than 1.)
 2. Acard, according to claim 1 , which can electrically, optically ormagnetically record readable and writable information and/or can recordinformation by embossing.
 3. A card, according to claim 1 or 2 , whereinthe thermoplastic resin composition is the composition II with adispersed structure in which a phase mainly consisting of theingredients (A) and (D) exists as a continuous phase.
 4. A card,according to claim 1 or 2 , wherein the thermoplastic resin compositionis the composition II with a dispersed structure in which a phase mainlyconsisting of the ingredients (D) and (B) exists as a continuous phase.5. A card, according to any one of claims 1 through 4, wherein thethermoplastic resin is the composition III.
 6. A card, according to anyone of claims 1 through 5, wherein the thermoplastic resin compositionis a composition consisting of the ingredients (A), (B), (C) and (D)with a dispersed structure in which a phase mainly consisting of theingredients (A) and (D) exists as a continuous phase.
 7. A card,according to any one of claims 1 through 5, wherein the thermoplasticresin composition is a composition consisting of the ingredients (A),(B), (C) and (D) with a dispersed structure in which a phase mainlyconsisting of the ingredients (D) and (B) exists as a continuous phase.8. A card, according to any one of claims 1 through 7, which isembossed.
 9. A card, according to any one of claims 1 through 8, whereinthe sheet-like filler is talc.
 10. A card, according to any one ofclaims 1 through 9, which is obtained by processing a sheet.
 11. A card,according to any one of claims 1 through 10, which is obtained byprocessing a multi-layer sheet produced by laminating a plurality ofsheets.
 12. A sheet, comprising a thermoplastic resin compositionconsisting of the following ingredients (A), (D) and (B): Ingredient(A): A polyester composed of dicarboxylic acid components withterephthalic acid component as a main dicarboxylic acid component andethylene glycol component (I) and 1,4-cyclohexanedimethanol component(II) as main glycol components, with the molar ratio (I)/(II) ofethylene glycol component (I) to 1,4-cyclohexanedimethanol component(II) kept at 1 or more Ingredient (B): An aromatic polycarbonateIngredient (D): A polyester composed of dicarboxylic acid componentswith terephthalic acid component as a main dicarboxylic acid componentand ethylene glycol component (I) and 1,4-cyclohexanedimethanolcomponent (II) as main glycol components, with the molar ratio (I)/(II)of ethylene glycol component (I) to 1,4-cyclohexanedimethanol component(II) kept at smaller than
 1. 13. A sheet, according to claim 12 ,wherein the thermoplastic resin composition has a dispersed structure inwhich a phase mainly consisting of the ingredients (A) and (D) exists asa continuous phase.
 14. A sheet, according to claim 12 , wherein a phasemainly consisting of the thermoplastic resin composition has a dispersedstructure in which a phase mainly consisting of the ingredients (D) and(B) exists as a continuous phase.
 15. A sheet, comprising athermoplastic resin composition consisting of 100 parts by weight of oneor more thermoplastic resins selected from the following ingredients(A), (B) and (D) and 2 to 25 parts by weight of the following ingredient(C): Ingredient (A): A polyester composed of dicarboxylic acidcomponents with terephthalic acid component as a main dicarboxylic acidcomponent and ethylene glycol component (I) and1,4-cyclohexanedimethanol component (II) as main glycol components, withthe molar ratio (I)/(II) of ethylene glycol component (I) to1,4-cyclohexanedimethanol component (II) kept at 1 or more Ingredient(B): An aromatic polycarbonate Ingredient (C): An inorganic sheet-likefiller of 0.5 to 20 μm in average grain size Ingredient (D): A polyestercomposed of dicarboxylic acid components with terephthalic acidcomponent as a main dicarboxylic acid component and ethylene glycolcomponent (I) and 1,4-cyclohexanedimethanol component (II) as mainglycol components, with the molar ratio (I)/(II) of ethylene glycolcomponent (I) to 1,4-cyclohexanedimethanol component (II) kept atsmaller than
 1. 16. A sheet, according to claim 15 , wherein thethermoplastic resin composition consists of 100 parts by weight, intotal, of the ingredients (A) and (B) and 2 to 25 parts by weight of theingredient (C).
 17. A sheet, according to claim 15 , wherein thethermoplastic resin composition consists of 100 parts by weight, intotal, of the ingredients (A), (D) and (B) and 2 to 25 parts by weightof the ingredient (C).
 18. A sheet, according to claim 17 , wherein thethermoplastic resin composition has a dispersed structure in which aphase mainly consisting of the ingredients (A) and (D) exists as acontinuous phase.
 19. A sheet, according to claim 17 , wherein thethermoplastic resin composition has a dispersed structure in which aphase mainly consisting of the ingredients (D) and (B) exists as acontinuous phase.
 20. A sheet, according to any one of claims 15 though19, wherein the sheet-like filler is talc.
 21. A multi-layer sheet,comprising a sheet made of a thermoplastic resin composition consistingof the following ingredients (A) and (B) as at least one layer:Ingredient (A): A polyester composed of dicarboxylic acid componentswith terephthalic acid component as a main dicarboxylic acid componentand ethylene glycol component (I) and 1,4-cyclohexanedimethanolcomponent (II) as main glycol components, with the molar ratio (I)/(II)of ethylene glycol component (I) to 1,4-cyclohexanedimethanol component(II) kept at 1 or more Ingredient (B): An aromatic polycarbonate.
 22. Amulti-layer sheet, according to claim 21 , wherein the thermoplasticresin composition further contains the following ingredient (D):Ingredient (D): A polyester composed of dicarboxylic acid componentswith terephthalic acid component as a main dicarboxylic acid componentand ethylene glycol component (I) and 1,4-cyclohexanedimethanolcomponent (II) as main glycol components, with the molar ratio (I)/(II)of ethylene glycol component (I) and 1,4-cyclohexanedimethanol component(II) kept at smaller than
 1. 23. A multi-layer sheet, according to claim22 , wherein the thermoplastic resin composition has a dispersedstructure in which a phase mainly consisting of the ingredients (A) and(D) exists as a continuous phase.
 24. A multi-layer sheet, according toclaim 22 , wherein the thermoplastic resin composition has a dispersedstructure in which a phase mainly consisting of the ingredients (D) and(B) exists as a continuous phase.
 25. A multi-layer sheet, according toany one of claims 21 through 24, which is embossed.
 26. A multi-layersheet, comprising a sheet made of a thermoplastic resin compositionconsisting of 100 parts by weight of one or more thermoplastic resinsselected from the ingredients (A), (B) and (D) and 2 to 25 parts byweight of the ingredient (C): Ingredient (A): A polyester composed ofdicarboxylic acid components with terephthalic acid component as a maindicarboxylic acid component and ethylene glycol component (I) and1,4-cyclohexanedimethanol component (II) as main glycol components, withthe molar ratio (I)/(II) of ethylene glycol component (I) to1,4-cyclohexanedimethanol component (II) kept at 1 or more Ingredient(B): An aromatic polycarbonate Ingredient (C): An inorganic sheet-likefiller of 0.5 to 20 μm in average grain size Ingredient (D): A polyestercomposed of dicarboxylic acid components with terephthalic acidcomponent as a main dicarboxylic acid component and ethylene glycolcomponent (I) and 1,4-cyclohexanedimethanol component (II) as mainglycol components, with the molar ratio (I)/(II) of ethylene glycolcomponent (I) to 1,4-cyclohexanedimethanol component (II) kept atsmaller than
 1. 27. A multi-layer sheet, according to claim 26 , whereinthe thermoplastic resin composition consists of 100 parts by weight, intotal, of the ingredients (A) and (B) and 2 to 25 parts by weight of theingredient (C).
 28. A multi-layer sheet, according to claim 26 , whereinthe thermoplastic resin composition consists of 100 parts by weight, intotal, of the ingredients (A), (D) and (B) and 2 to 25 parts by weightof the ingredient (C).
 29. A multi-layer sheet, according to claim 28 ,wherein the thermoplastic resin composition has a dispersed structure inwhich a phase mainly consisting of the ingredients (A) and (D) exists asa continuous phase.
 30. A multi-layer sheet, according to claim 28 ,wherein the thermoplastic resin composition has a dispersed structure inwhich a phase mainly consisting of the ingredients (D) and (B) exists asa continuous phase.
 31. A multi-layer sheet, according to any one ofclaims 26 through 30, wherein the sheet-like filler is talc.
 32. Amulti-layer sheet, according to any one of claims 26 through 31, whereina sheet made of a thermoplastic resin composition consisting of one ormore selected from the ingredients (A), (B) and (D), and the ingredient(C) is provided as an inner layer.
 33. A multi-layer sheet, according toclaim 32 , wherein a sheet made of a thermoplastic resin compositionconsisting of the ingredients (A) and (B) is provided as a surfacelayer.
 34. A multi-layer sheet, according to claim 33 , wherein thethermoplastic resin composition consisting of the ingredients (A) and(B) further contains the ingredient (D).
 35. A multi-layer sheet,according to claim 34 , wherein the thermoplastic resin compositionconsisting of the ingredients (A), (B) and (D) has a dispersed structurein which a phase mainly consisting of the ingredients (A) and (D) existsas a continuous phase.
 36. A multi-layer sheet, according to claim 34 ,wherein the thermoplastic resin composition consisting of theingredients (A), (B) and (D) has a dispersed structure in which a phasemainly consisting of the ingredients (D) and (B) exists as a continuousphase.
 37. A multi-layer sheet, according to any one of claims 26through 36, which is embossed.
 38. A card, according to any one ofclaims 1 through 9, which is produced by injection molding of thethermoplastic resin composition.
 39. A thermoplastic resin composition,comprising the following ingredients (A), (D) and (B): Ingredient (A): Apolyester composed of dicarboxylic acid components with terephthalicacid component as a main dicarboxylic acid component and ethylene glycolcomponent (I) and 1,4-cyclohexanedimethanol component (II) as mainglycol components, with the molar ratio (I)/(II) of ethylene glycolcomponent (I) to 1,4-cyclohexanedimethanol component (II) kept at 1 ormore Ingredient (B): An aromatic polycarbonate Ingredient (D): Apolyester composed of dicarboxylic acid components with terephthalicacid component as a main dicarboxylic acid component and ethylene glycolcomponent (I) and 1,4-cyclohexanedimethanol component (II) as mainglycol components, with the molar ratio (I)/(II) of ethylene glycolcomponent (I) to 1,4-cyclohexanedimethanol component (II) kept atsmaller than
 1. 40. A thermoplastic resin composition, according toclaim 39 , which has a dispersed structure in which a phase mainlyconsisting of the ingredients (A) and (D) exists as a continuous phase.41. A thermoplastic resin composition, according to claim 39 , which hasa dispersed structure in which a phase mainly consisting of theingredients (D) and (B) exists as a continuous phase.
 42. Athermoplastic resin composition, comprising 100 parts by weight of oneor more thermoplastic resin compositions selected from the followingingredients (A), (B) and (D) and 2 to 25 parts by weight of thefollowing ingredient (C): Ingredient (A): A polyester composed ofdicarboxylic acid components with terephthalic acid component as a maindicarboxylic acid component and ethylene glycol component (I) and1,4-cyclohexanedimethanol component (II) as main glycol components, withthe molar ratio (I)/(II) of ethylene glycol component (I) to1,4-cyclohexanedimethanol component (II) kept at 1 or more Ingredient(B): An aromatic polycarbonate Ingredient (C): An inorganic sheet-likefiller of 0.5 to 20 μm in average grain size Ingredient (D): A polyestercomposed of dicarboxylic acid components with terephthalic acidcomponent as a main dicarboxylic acid component and ethylene glycolcomponent (I) and 1,4-cyclohexanedimethanol component (II) as mainglycol components, with the molar ratio (I)/(II) of ethylene glycolcomponent (I) to 1,4-cyclohexanedimethanol component (II) kept atsmaller than
 1. 43. A thermoplastic resin composition, according toclaim 42 , which consists of 100 parts by weight, in total, of theingredients (A) and (B) and 2 to 25 parts of the ingredient (C).
 44. Athermoplastic resin composition, according to claim 42 , which consistsof 100 parts by weight, in total, of the ingredients (A), (D) and (B)and 2 to 25 parts by weight of the ingredient (C).
 45. A thermoplasticresin composition, according to claim 44 , which has a dispersedstructure in which a phase mainly consisting of the ingredients (A) and(D) exists as a continuous phase.
 46. A thermoplastic resin composition,according to claim 44 , which has a dispersed structure in which a phasemainly consisting of the ingredients (D) and (B) exists as a continuousphase.